Skip to main content

RTL Design Engineer at Skyroot Aerospace

Hello, Dear Readers, Skyroot Aerospace has a vacancy for the RTL Design Engineer role. About Skyroot Aerospace: A cutting-edge startup founded by ex-ISRO scientists. Dedicated to affordable space access, we're rewriting aerospace technology rules. Our dynamic team fosters inventiveness, collaboration, and relentless excellence. Join us on a transformative journey to redefine space possibilities. Welcome to the forefront of space innovation with Skyroot Aerospace! Purpose of role: Understand architectural requirements and Design micro-architecture, implement design blocks using VHDL/Verilog for FPGA based Avionics packages for orbital launch vehicles and ground infrastructure. Job Requirements: 2+ Years of RTL and system design experience. Strong knowledge on Digital System Design (DSD). Strong knowledge of RTL/SoC design/integration with VHDL/Verilog. Strong knowledge in problem solving and debugging skills. Ability to understand architectural requirements and Design micro-archite...
Post a Comment

PowerVia: Revolutionary Test Shows Industry Leading Performance

 Hello Dear Readers, 

Today in this post, learn about PowerVia Test which is Intel's first to implement backside power in a product like chip, resulting in over 90% cell utilization and other gains. 



Intel is the first in the industry to implement backside power delivery on a product-like test chip, achieving the performance needed to propel the world into the next era of computing. PowerVia, which will be introduced on the Intel 20A process node in the first half of 2024, is Intel’s industry-leading backside power delivery solution. It solves the growing issue of interconnect bottlenecks in area scaling by moving power routing to the backside of a wafer.

PowerVia is a major milestone in our aggressive ‘five nodes in four years’ strategy and on our path to achieving a trillion transistors in a package in 2030. Using a trial process node and subsequent test chip-enabled us to de-risk backside power for our leading process nodes, placing Intel a node ahead of competitors in bringing backside power delivery to market.

How It Works:

Intel decoupled the development of PowerVia from transistor development to ensure its readiness for silicon implementation based on Intel 20A and Intel 18A process nodes. PowerVia was tested on its own internal test node to debug and ensure good functionality of the technology before its integration with RibbonFET in Intel 20A. After fabrication and testing on a silicon test chip, PowerVia was confirmed to bring a remarkably efficient use of chip resources with greater than 90% cell utilization and major transistor scaling, enabling chip designers to achieve performance and efficiency gains in their products.

Why It Matters:

PowerVia is well ahead of competitors’ backside power solutions, giving chip designers – including Intel Foundry Services (IFS) customers – a faster path to valuable energy and performance gains in their products. Intel has a long track record of introducing the industry’s most critical new technologies, such as strained silicon, Hi-K metal gate, and FinFET, to propel Moore’s Law forward. With PowerVia and RibbonFET gate-all-around technology coming in 2024, Intel continues to lead the industry in chip design and process innovations.   

PowerVia is the first to solve the growing interconnect bottleneck issue for chip designers. Surging use cases, including artificial intelligence and graphics, require smaller, denser, and more powerful transistors to meet ever-growing computing demands. Today and for the past many decades, power and signal lines within a transistor’s architecture have competed for the same resources. By separating the two, chips can increase performance and energy efficiency, and deliver better results for customers. Backside power delivery is vital to transistor scaling, enabling chip designers to increase transistor density without sacrificing resources to deliver more power and performance than ever. 



How They Are Doing It: 

Intel 20A and Intel 18A will introduce both PowerVia backside power technology and RibbonFET gate-all-around technology. As a completely new way of delivering power to the transistors, backside power implementation raised new challenges for thermals and debugging designs.  

By decoupling the development of PowerVia from RibbonFET, Intel could work through those challenges quickly to ensure readiness for implementation in silicon based on Intel’s 20A and 18A process nodes. Intel engineers developed mitigation techniques to prevent the thermals from becoming an issue. The debug community also developed new techniques to ensure the new design structure could be appropriately de-bugged. As a result, the test implementation delivered solid yield and reliability metrics while demonstrating the intrinsic value proposition of the technology well before it joins the new RibbonFET architecture. 

The test also leveraged design rules enabled by EUV (extreme ultraviolet) lithography, which produced results including standard cell utilization of more than 90% over large areas of the die, enabling greater cell density, which can be expected to lower costs. The test also showed more than 30% platform voltage droop improvement and a 6% frequency benefit. Intel also achieved thermal characteristics in the PowerVia test chip in line with higher power densities expected from logic scaling. 


Importance of 3DIC Ecosystem in the VLSI Market


Connect with me 

4.WhatsApp 

Comments

Post a Comment

Popular posts from this blog

Exploring the Role of LEF Files in VLSI Chip Design: A Beginner's Guide

Hello Dear Readers,   Today in this post, I will provide some deep insight into the LEF file role during the VLSI Chip Design process. In VLSI (Very Large Scale Integration) design, a LEF file is a file that contains information about the physical geometry of the standard cells used in a circuit. LEF stands for Library Exchange Format. A standard cell is a pre-designed logic cell that contains a specific function, such as a flip-flop or an AND gate. Standard cells are designed to be easily combinable and scalable to create more complex circuits. The physical geometry of each standard cell is defined in the LEF file. The LEF file contains information such as the width, height, and position of the pins and metal layers of each standard cell. It also contains information about the physical design rules that govern the placement of these cells on the chip. LEF files are important in VLSI design because they enable the interoperability of different design tools from different vend...
4 comments
Read more

Internship - SoC /IP Design at NXP India

Hello Dear Readers, Currently, at NXP India  vacancy for  Internship - SoC /IP Design   role.   We are looking for a Master degree student with Electronics and Communication Engineering, or related field, with an emphasis on SoC design. This is a full-time internship with a duration of about 11-12 months. Job Responsibility: Working with our experienced design team to design state of the art SoC hardware specific segment applications like Automotive, IoT, voice/object recognition, security, smart connectivity and touch sensing . Assisting experienced engineers with End-to-end ownership of SoC Design, Verification and implementation (Physical Design). Design and verify digital and Mixed-signal IPs. Document designs and present results. Job Qualification: Master student in electronic/computer engineering Creative and positive mindset Good knowledge on CMOS technologies Great communication skills, interpersonal skills, teamwork skills and can-do attitude Desire for a ca...
Post a Comment
Read more

IC Design Engineer at Broadcom

  Hello Dear Readers, Currently, at Broadcom vacancy for an IC Design Engineer role. Job Description: Candidate would be required to work on various phases of SOC physical design activities. The job will include but not limited to block level – floor-planning, partitioning, placement, clock tree synthesis, route, physical verification (LVS/DRC/ERC/Antenna etc). Should be able to meet congestion, timing and area metrics.  Candidate would be required to do equivalence checks, STA, Crosstalk delay analysis, noise analysis, power optimization. Should be able to implement timing and functional ECOs. Should have excellent problem-solving skill to help through congestion resolution and timing closure. Should have experience formal verification and timing analysis and ECO implementation. Experience with tools such as Innovus/Encounter, ICC, Caliber, LEC, Primetime etc is highly desirable. Candidate should be able to work independently and guide other team members. Should be ...
Post a Comment
Read more