Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello, Dear Readers, Skyroot Aerospace has a vacancy for the RTL Design Engineer role. About Skyroot Aerospace: A cutting-edge startup founded by ex-ISRO scientists. Dedicated to affordable space access, we're rewriting aerospace technology rules. Our dynamic team fosters inventiveness, collaboration, and relentless excellence. Join us on a transformative journey to redefine space possibilities. Welcome to the forefront of space innovation with Skyroot Aerospace! Purpose of role: Understand architectural requirements and Design micro-architecture, implement design blocks using VHDL/Verilog for FPGA based Avionics packages for orbital launch vehicles and ground infrastructure. Job Requirements: 2+ Years of RTL and system design experience. Strong knowledge on Digital System Design (DSD). Strong knowledge of RTL/SoC design/integration with VHDL/Verilog. Strong knowledge in problem solving and debugging skills. Ability to understand architectural requirements and Design micro-archite...