Hello Dear Readers, Today in this post, I will provide some deep insight into the Signal Electromigration (Signal EM): Violations, Examples, and Practical Fixes. 1. Introduction: As technology nodes shrink into the deep‑submicron and nanometer regime (7nm, 5nm, 3nm and beyond), electromigration (EM) has become a first‑order reliability concern—not only for power/ground (PG) networks but also for signal nets. Signal EM failures are often underestimated because signal currents are transient and bidirectional. However, with higher switching activity, tighter metal pitches, thinner wires, and aggressive timing closure, signal EM can cause latent or early‑life failures if not addressed properly. This article explains: What Signal EM is and how it differs from PG EM Typical Signal EM violation scenarios Detailed, practical examples Root causes behind each violation Proven solutions and best practices to fix and prevent Signal EM issues 2. What is Signal Electromigration: El...
Hello Dear Readers, Today in this post I will provide some deep insight into what is happening in the semiconductor industry. So I hope you like it and enjoy it to improve your knowledge and awareness about the industry. So let's start it today we are discussing, The Importance of 3D IC Ecosystem Collaboration in the VLSI Market. As design teams continue to develop new generations of transformative products, the demand for computing remains relentless. Modern workloads have brought packaging technologies to the forefront for innovation and pushed the boundaries for silicon product design in terms of product performance, function and cost. Not too long ago, packaging technologies were thought of as inconvenient back-end processes. But times have changed, and rising advancements in artificial intelligence, big data, cloud computing, and autonomous vehicles have pushed the computing envelope unlike ever before (along with the need for packaging technologi...