Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Currently, after succeeding up to this today, I will start new NPTEL courses per VLSI and ECE branch job profiles. So let's start with today's RTL/FPGA engineer profiles courses. 1. HARDWARE MODELING USING VERILOG: Coordinators: PROF. INDRANIL SENGUPTA Department of Computer Science and Engineering IIT Kharagpur INTENDED AUDIENCE: CSE, ECE, EE PRE-REQUISITES: Basic concepts in digital circuit design, Familiarity with a programming language like C or C++ INDUSTRIES APPLICABLE TO: Intel, Cadence, Mentor Graphics, Synopsys, Xilinx COURSE OUTLINE: The course will introduce the participants to the Verilog hardware description language. It will help them to learn various digital circuit modeling issues using Verilog, writing test benches, and some case studies. ABOUT INSTRUCTOR: Prof. Indranil Sengupta has obtained his B.Tech., M.Tech. and Ph.D. degrees in Computer Science and Engineering (CSE) from the University of Calcutta. H...