Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Today in this post, I will provide some deep insight into Low Power Design: Common Power Format syntax and how to implement it. CPF (Common Power Format) CPF is power intent as similar as UPF which we have seen earlier. CPF structure is like UPF, only difference is UPF is handled by Synopsys VC static/dynamic tool, whereas CPF is handled only by Cadence’s CLP tool. Below is Low Power flow for CPF: CPF Implementation Flow Commands of CPF and UPF are much more similar only difference is in few syntax, will try to write CPF for below design block: Commands of CPF and UPF are much more similar only difference is in few syntax, let’s have glance of CPF commands below: #Definition of top domain set_design top #Define the top power domain create_power_domain –name pdTOP –default #Define pdA create_power...