Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Today in this post I will provide some basics to advanced ARM's assembly language practice QA part-2, I have used the Keil tool for code writing. Q-1). Write an assembly language program for storing the sum of first ‘n=6’ terms of the series 1,4,9,16,25….. Code: ; program for the addition of the n=6 series area sum_series, code,readonly entry mov r2,#0 mov r0,#6 loop muls r1,r0,r0 ; multiply square number add r2,r2,r1 ; whole sum is stored on register "r2" subs r0,r0,#1 bne loop end Output: Q-2). Write an assembly language program to find the maximum of 3 numbers and store it at location 0x5000. Code: ; program to find maximum number of 3 and store in memory area max, code, readonly entry ldr r0,=data ldr r3,=0x5000 ldr r4,=0x03 ;create a loop of 3 ldr r1,[r0, #4] sub r4,r4,#1 again ldr r2,[r0] ...