Skip to main content

Design Engineer - STA, SD, Power, PDN at Dew Software

Hello Dear Readers,   Currently at Dew Software Bangalore vacancy for Design Engineer - STA, SD, Power, PDN role. Dew Software, a leading player in the Digital Transformation space, is seeking a skilled Design Engineer specializing in STA (Static Timing Analysis), SD (Signal Integrity), Power, and PDN (Power Delivery Network) to join our team. Working with Fortune 500 companies to support their digital innovation and transformation strategies, the Design Engineer will be responsible for ensuring the integrity and efficiency of digital designs through comprehensive analysis and optimization. Dew Software is dedicated to delivering exceptional outcomes with cutting-edge technologies, and this is an excellent opportunity to contribute to the growth and success of our clients. Responsibilities: Perform STA (Static Timing Analysis) to ensure design meets timing requirements Conduct signal integrity analysis to optimize signal integrity and minimize signal integrity issues Provide power anal

Exploring the Role of LEF Files in VLSI Chip Design: A Beginner's Guide

 Hello Dear Readers, 

Today in this post, I will provide some deep insight into the LEF file role during the VLSI Chip Design process.

In VLSI (Very Large Scale Integration) design, a LEF file is a file that contains information about the physical geometry of the standard cells used in a circuit. LEF stands for Library Exchange Format.

A standard cell is a pre-designed logic cell that contains a specific function, such as a flip-flop or an AND gate. Standard cells are designed to be easily combinable and scalable to create more complex circuits. The physical geometry of each standard cell is defined in the LEF file.

The LEF file contains information such as the width, height, and position of the pins and metal layers of each standard cell. It also contains information about the physical design rules that govern the placement of these cells on the chip.

LEF files are important in VLSI design because they enable the interoperability of different design tools from different vendors. The LEF file can be used by layout tools to place and route the standard cells on the chip, and by verification, tools to check that the design meets the physical design rules. The LEF file is also used in the manufacturing process to create the mask layers used to fabricate the chip.

There are two main types of LEF files used in VLSI design:

  • Technology LEF (TechLEF): A TechLEF file contains information about the physical and electrical properties of the fabrication process used to create the integrated circuit. It defines the layers, the stack up, the routing grid, the via rules, and other technology-specific parameters. It is usually provided by the foundry or semiconductor manufacturer and is used by the design team to create the standard cell library and the chip design.
  • Library Exchange Format (LEF): An LEF file contains information about the physical geometry of the standard cells in a library. It specifies the width, height, location, and pin information of the cells, as well as the timing and power characteristics of each cell. LEF files are created by the library provider, such as a third-party IP vendor or an internal library team, and are used by the design team to place and route the cells in the chip design.

Both TechLEF and LEF files are important in VLSI design, as they enable the interoperability of different design tools and provide the necessary information to accurately model the chip design and optimize its performance.

Let's consider the below image for one complete understanding of the LEF file with respect to the DEF file definition.


Compete LEF file Example:

Here below shown the complete LEF file example for the one standard cell AND2X1.

VERSION 5.7 ;         # LEF format version

 

# Define the standard cell

MACRO AND2X1 ;        # Specify the name of the standard cell

  CLASS CORE ;        # Specify the class of the cell

  FOREIGN LEF58 ;     # Specify the format of the cell

  ORIGIN 0 0 ;        # Specify the origin of the cell

  SIZE 2.40 BY 3.60 ; # Specify the size of the cell

  SITE CORE ;         # Specify the site of the cell

  SYMMETRY X Y R90 ;  # Specify the symmetry of the cell

 

  # Define the power and ground connections

  POWER VDD ;          # Define the power connection

    LAYER metal1 ;     # Specify the metal layer

    WIDTH 0.1 ;        # Specify the width of the layer

    SHAPE RECTANGLE ;  # Specify the shape of the connection

    PORT

      RECT 2.4 0 2.5 3.6 ; # Define the rectangular shape of the connection

    END PORT

  END VDD

  GROUND VSS ;         # Define the ground connection

    LAYER metal1 ;     # Specify the metal layer

    WIDTH 0.1 ;        # Specify the width of the layer

    SHAPE RECTANGLE ;  # Specify the shape of the connection

    PORT

      RECT 0 0 0.1 3.6 ; # Define the rectangular shape of the connection

    END PORT

  END VSS

 

  # Define the pins

  PIN A ;             # Define the input A pin

    DIRECTION INPUT ; # Specify the direction of the pin

    USE SIGNAL ;      # Specify the use of the pin

    SHAPE ABUTMENT ;  # Specify the shape of the pin

    PORT

      LAYER metal1 ;  # Define the metal layer of the pin

      RECT 0 0 0.1 0.1 ; # Define the rectangular shape of the pin

    END PORT

  END A

 

  PIN B ;             # Define the input B pin

    DIRECTION INPUT ; # Specify the direction of the pin

    USE SIGNAL ;      # Specify the use of the pin

    SHAPE ABUTMENT ;  # Specify the shape of the pin

    PORT

      LAYER metal1 ;  # Define the metal layer of the pin

      RECT 0 0.2 0.1 0.3 ; # Define the rectangular shape of the pin

    END PORT

  END B

 

  PIN Z ;             # Define the output Z pin

    DIRECTION OUTPUT ; # Specify the direction of the pin

    USE SIGNAL ;      # Specify the use of the pin

    SHAPE ABUTMENT ;  # Specify the shape of the pin

    PORT

      LAYER metal1 ;  # Define the metal layer of the pin

      RECT 2.3 1.8 2.4 1.9 ; # Define the rectangular shape of the pin

    END PORT

  END Z

 

  # Define the metal layers and routing grid

  LAYER metal1 ;        # Define the metal1 layer

    WIDTH 0.1 ;         # Specify the width of the layer

    SPACING 0.2 ;       # Specify the spacing of the layer

    DIRECTION HORIZONTAL ; # Specify the direction of the layer

    OFFSET 0 1.8 ;      # Specify the offset of the layer

LAYER metal2 ;        # Define the metal2 layer

    WIDTH 0.2 ;         # Specify the width of the layer

    SPACING 0.4 ;       # Specify the spacing of the layer

    DIRECTION HORIZONTAL ; # Specify the direction of the layer

    OFFSET 0 1.6 ;      # Specify the offset of the layer

  END metal2

 

  # Define the vias

  VIA M1M2 ;             # Define the M1M2 via

    LAYER metal1 ;       # Specify the layer of the via

    RECT 0.1 0.15 0.2 0.25 ; # Specify the rectangular shape of the via

    CUTSIZE 0.1 BY 0.1 ; # Specify the size of the cut

    LAYERTYPE CUT ;      # Specify the type of the layer

    LAYER metal2 ;       # Specify the layer


Importance of the LEF files:

LEF (Library Exchange Format) file is important in EMIR (Electromagnetic Interference and Reliability) analysis because it contains detailed information about the layout and geometry of the standard cells, macros, and I/O cells in a design. This information is used by the EMIR analysis tools to simulate and analyze the electromagnetic behavior of the design.

EMIR analysis is an important step in the design process to ensure that the final design is reliable and meets the required EMI (Electromagnetic Interference) specifications. The EMIR analysis tools use the LEF file to extract the relevant geometrical information such as metal layer stackup, via positions, and dimensions of the standard cells.

During the analysis, the tools apply a set of electromagnetic simulations to the design, which can include crosstalk, noise, and signal integrity analysis. The results of the analysis are then used to identify any areas of the design that may be susceptible to electromagnetic interference, such as coupling between metal traces or excessive radiation emissions.

LEF (Library Exchange Format) files are an essential part of the complete tapeout process of chips in the semiconductor industry. They contain information about the physical and electrical characteristics of the cells and macros that make up a chip design. Here are some ways LEF files are used in the tapeout process:

  • Design Rule Checking (DRC): Before a design can be fabricated, it must pass DRC, which verifies that the design adheres to the rules of the manufacturing process. DRC checks the design against a set of rules that define minimum feature sizes, spacing, and other design criteria. LEF files are used to define the shapes and sizes of the cells and macros, which are used in the DRC process.
  • Layout vs. Schematic (LVS) Verification: LVS is a process that verifies that the layout of the chip matches the schematic. LVS checks for consistency between the layout and the netlist, which is a list of all the components and their connections in the design. LEF files are used to define the layout of the cells and macros, which are compared against the netlist during LVS verification.
  • Parasitic Extraction: Parasitic extraction is the process of extracting parasitic capacitance and resistance values from the layout of the design. Parasitic values can affect the performance of the design, so it's important to extract them accurately. LEF files provide the geometric information needed to accurately extract parasitic values.
  • Mask Generation: After DRC and LVS verification, the design is ready for mask generation, which is the process of creating the physical masks used to manufacture the chip. The mask data is generated from the layout data in the LEF files.

In summary, LEF files play a critical role in the tape-out process of chips by providing the geometric and electrical information needed for design rule checking, layout vs. schematic verification, parasitic extraction, and mask generation.

I hope you guys like the content and stay tuned for more updates. 


Front End Vs Back End in the VLSI Industry

Connect with me 

4.WhatsApp 

Comments

Post a Comment

Popular posts from this blog

Apprenticeship CAI at MediaTek Bangalore

Hello Dear Readers,   Currently at MediaTek Bangalore vacancy for an Apprenticeship CAI role. Job Description: B.Tech degree in Electrical/Electronics Engineering with a strong educational background in Digital circuit design Experience in physical design of high performance design with frequencies > 2 Ghz. Experienced in hierarchical design, budgeting, multiple voltage domains and multiple clock domains. Strong skills with Cadence Encounter. Solid understanding of STA and timing constraints. Experienced in working on advanced process nodes (16nm). Strong expertise in Physical Verification to debug LVS/DRC issues at the block level. Requirement: B.Tech degree in Electrical/Electronics Engineering with strong educational background in Digital circuit design Experience in physical design of high performance design with frequencies > 2 Ghz. Experienced in hierarchical design, budgeting, multiple voltage domains and multiple clock domains. Strong skills with Cadence Encounter. Solid

Power Analysis in the VLSI Chip Design

  Hello Dear Readers,   Today in this series of posts I will provide some deep insight into Power Analysis in the VLSI Chip Design. The power analysis flow calculates (estimates of) the active and static leakage power dissipation of the SoC design. This electrical analysis step utilizes the detailed extraction model of the block and global SoC layouts. The active power estimates depend on the availability of switching factors for all signals in the cell netlist. Representative simulation test cases are applied to the netlist model, and the signal value change data are recorded. The output data from the power analysis flow guide the following SoC tape out release assessments:  Total SoC power specification (average and standby leakage): The specification for SoC power is critical for package selection and is used by end customers for thermal analysis of the product enclosure. In addition to the package technology selection, the SoC power dissipation is used to evaluate the die attach ma

IC Physical Design (PnR) at Ulkasemi

Hello Dear Readers,   Ulkasemi  has a vacancy for an IC Physical Design (PnR) role. Job Overview: As a full-time Trainee Engineer, the individual will be working on IC Physical Design implementation from RTL to GDSII to create design databases ready for manufacturing with a special focus on power, performance & area optimization with next-generation state-of-the-art process technologies. Job Responsibilities: Perform physical design implementation which includes Floor planning, Power Planning, Clock Tree Synthesis, Place and Route, ECO, Logic Equivalence checks Timing analysis, physical & electrical verification, driving the sign-off closure meeting schedule, and design goals Develop flow, methodologies, and automation scripts for various implementation steps Follow the instructions, compile documents, prepare deliverables, and report to the team lead Should remain up to date with the latest technology trends Educational Qualification:   B.Sc/M.Sc   in EEE or equivalent degree