Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers,
Currently, at Broadcom vacancy for an IC Design Engineer role.
Job Description:
- Candidate would be required to work on various phases of SOC physical design activities. The job will include but not limited to block level – floor-planning, partitioning, placement, clock tree synthesis, route, physical verification (LVS/DRC/ERC/Antenna etc).
- Should be able to meet congestion, timing and area metrics. Candidate would be required to do equivalence checks, STA, Crosstalk delay analysis, noise analysis, power optimization. Should be able to implement timing and functional ECOs.
- Should have excellent problem-solving skill to help through congestion resolution and timing closure. Should have experience formal verification and timing analysis and ECO implementation.
- Experience with tools such as Innovus/Encounter, ICC, Caliber, LEC, Primetime etc is highly desirable.
- Candidate should be able to work independently and guide other team members. Should be experienced in working in a global team and dynamic environment.
- Should possess ability to learn and adapt to new tools and methodologies.
- Excellent communication skill is a must.
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