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Signal Electromigration (Signal EM): Violations, Examples, and Practical Fixes

  Hello Dear Readers,   Today in this post, I will provide some deep insight into the Signal Electromigration (Signal EM): Violations, Examples, and Practical Fixes. 1. Introduction: As technology nodes shrink into the deep‑submicron and nanometer regime (7nm, 5nm, 3nm and beyond), electromigration (EM) has become a first‑order reliability concern—not only for power/ground (PG) networks but also for signal nets. Signal EM failures are often underestimated because signal currents are transient and bidirectional. However, with higher switching activity, tighter metal pitches, thinner wires, and aggressive timing closure, signal EM can cause latent or early‑life failures if not addressed properly. This article explains: What Signal EM is and how it differs from PG EM Typical Signal EM violation scenarios Detailed, practical examples Root causes behind each violation Proven solutions and best practices to fix and prevent Signal EM issues 2. What is Signal Electromigration: El...
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Physical Design Engineer at Texas Instruments

Hello Dear Readers,

At Texas Instruments Bangalore, there is a vacancy for the Physical Design Engineer role.

The Radar and Analytics group at Texas Instruments India is looking for passionate Physical Design Engineer to work on next-gen CMOS single-chip millimeter wave sensor portfolio for Automotive Radar and Industrial applications. Physical Design team here owns Complete SoC Synthesis to Layout closure including constraints development and STA & is responsible for design handoff to manufacturing. Physical Design team at Radar & Analytics also works closely with systems and designs team for PPA optimization and has good knowledge of system aspects of the device usage. 

Responsibilities:

  • As a Physical Design Engineer in the team, you will be working independently on the entire flow from RTL to GDSII.
  • Understand the design, clock architecture, reset architecture, DFT architecture and influence them as per Physical Design needs.
  • Responsible for Place & Route, Reliability and Physical verification, Reliability closure
  • Methodologies to keep the PD cycle efficient and predictable.
  • Techniques to reduce Power and Area to make the device competitive
  • Techniques used in automotive designs.
  • Ability to interface with Fab and Qualification teams.


Minimum Qualifications:

  • Bachelor or Master’s degree in Electrical/Electronics Engineering.
  • 1-2 years of Industry experience
  • Understanding of DFT architectures
  • Good understanding and mastery in PD flow using Cadence tools and basic TCL scripting.
  • Knowledge of design requirements and guidelines for automotive applications and associated analog DFT hooks is a desirable
  • High speed (up to 2Ghz) design closure experience
  • Experience/Understanding of Backend flows like Synthesis, Floorplan & Powerplan, Placement, Clock Tree Synthesis, Route, STA, Reliability & Physical verification closure.


Preferred Skills/ Experience:

  • Experienced with IC design and full development cycle from definition through release to production.
  • Effective communication skills to interact with all stakeholders.
  • Team and People Skills: The candidate should have good people skills to work closely with the systems, analog, layout and test team
  • Must be highly focused and remain committed to obtaining closure on project goals


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