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Signal Electromigration (Signal EM): Violations, Examples, and Practical Fixes

  Hello Dear Readers,   Today in this post, I will provide some deep insight into the Signal Electromigration (Signal EM): Violations, Examples, and Practical Fixes. 1. Introduction: As technology nodes shrink into the deep‑submicron and nanometer regime (7nm, 5nm, 3nm and beyond), electromigration (EM) has become a first‑order reliability concern—not only for power/ground (PG) networks but also for signal nets. Signal EM failures are often underestimated because signal currents are transient and bidirectional. However, with higher switching activity, tighter metal pitches, thinner wires, and aggressive timing closure, signal EM can cause latent or early‑life failures if not addressed properly. This article explains: What Signal EM is and how it differs from PG EM Typical Signal EM violation scenarios Detailed, practical examples Root causes behind each violation Proven solutions and best practices to fix and prevent Signal EM issues 2. What is Signal Electromigration: El...
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Senior Physical Design Engineer at Samsung Electronics

Hello Dear Readers,

Currently, at Samsung Electronics Bangalore vacancy for a Senior Physical Design Engineer role.

About the job:

Complex SOC Top Physical Implementation for next generation SoCs in area of mobile application processors, modem sub-systems and connectivity chips

by means of Synthesis , Place and Route, STA , timing and physical signoffs


  •  Hands-on experience doing physical design and timing closure of complex blocks and full-chip designs
  • Should have strong understanding of timing, power, and area trade-offs and optimization of PPA
  • Power user of industry-standard tools (ICC/DC/PT/VSLP/Redhawk/Calibre/Formality) and able to understand their capabilities
  • Should have solid understanding of scripting languages such as Perl/Tcl and implementation flows
  • Experience with large SOC designs (>20M gates) with frequencies in excess of 1GHZ .
  • Expertise in block level and full-chip SDC cleanup, Synthesis optimization, Low Power checking and logic equivalence checking
  • Familiar with deep sub-micron designs (8nm/5nm) and associated issues (manufacturability, power, signal integrity, scaling)
  • Familiar with typical SoC issues such as multiple voltage and clock domains, ESD strategies, mixed signal block integration, and package interactions.
  • Familiar in a hierarchical design, top-down design, budgeting, timing, and physical convergence
  • Experience in top level floor planning including partition shaping and sizing, pin placement, channel planning,
  • high-speed signal and clock planning and feed-through planning is a plus
  • Good understanding of Physical Design Verification methodology to debug LVS/DRC issues at chip/block level
  • Should have gone through recent successful SoC tape-outs
  • Should have 3 ~ 15 years of experience in physical implementation and design

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