Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Today in this post I will provide some basics to advanced ARM's assembly language practice QA I have used the Keil tool for code writing. Q-1). Perform subtraction of the numbers stored at memory location 0x4000 from the number stored at memory location 0x4004 and place the result in memory location 0x4008. Code: ; Program of the substraction area into, code, readonly entry mov r1, #0x4000 ldr r2,[r1] ldr r3,[r1, #4] sub r4,r3,r2 ; perform substraction operation str r4,[r1, #8] ; store the result at memory location 0x4008 end Output: Q-2). Write a program to check whether the number stored at the memory location is even or odd. Code: ; program for identity number is even or odd area prog2, code, readonly entry mov r1,#0x4000 ; data location ldr r2,[r1] tst r2,#1 ; anding with 0x01 will be updating status of flag register bne odd mov...