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VLSI Packaging Evolution and Innovations

Hello Dear Readers,   Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
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Physical Design Engineer (All Levels) at InSemi Technology

 Hello Dear Readers, 

Currently at InSemi Technology vacancy for a Physical Design Engineer role.

Preferred Education:

  • B.Tech/M.Tech

Area of Expertise:

  • Good knowledge of VLSI process and device characteristics
  • Experience doing physical design targeted to the 7nm/16nm FinFet process
  • Good knowledge of cell libraries’ various views and models
  • Good understanding of static timing analysis (STA), EM/IR, and sign-off.
  • Strong hands-on experience with Chip Level / Sub-chip level floor planning, > partition, pin assignment, Power planning, Bump Planning, Pad Ring Creation, > Block level physical implementation, timing closure, physical verification, Chip level integration of different sub-blocks, and custom macros/IPs, Timing, IR/EM analysis and closure, Physical Verification – block and chip level
  • EDA Tool Expertise: Innovus, Tempus/PrimeTime-SI, Voltus/RedHawk, StarXT/Quantus, Calibre,LEC, etc
  • Good software and scripting skills (Python, tcl)
  • Good communication skills and the ability and desire to work as part of a team
  • Self-driven individual and an excellent team player
  • Good communication abilities

 Apply Here

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