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VLSI Packaging Evolution and Innovations

Hello Dear Readers,   Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
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Silicon CPU/ SOC Verification Engineer at Rivos Inc

   Hello Dear Readers,

Currently at Rivos Bangalore vacancy for a Silicon CPU/ SOC Verification Engineer role.

Positions are open for full-time and Co-op/internship in the areas of CPU and SOC verification from unit level to chip level as well as all aspects of verification such as functional, microarchitecture, performance, and formal.

We are looking for all levels of talent, from entrance to advanced level of experience.


Responsibilities:

  • Work closely with architecture and RTL designers on verifying the functionality correctness of the design
  • Reviewing Architecture and Design Specifications
  • Develop test plans and test environments
  • Develop tests in assembly, C/C++, or vectors according to test plans
  • Develop coverage monitors and analyze coverage to ensure all the test cases in the plans are covered
  • Develop checkers in SystemVerilog or C-base transactors to verify the design
  • Write assertions and apply formal verification to the designImplementing test benches, generating directed/constrained random tests
  • Debugging failures, running simulations, tracking bugs
  • Handling schedules and supporting multi-functional engineering effortAssisting in verification flows, automation scripts and regressions


Requirements:

  • In-depth knowledge of digital logic design, CPU/SOC architecture and microarchitecture.
  • Sophisticated knowledge of SystemVerilog.
  • Experienced level knowledge C/C++.Relevant knowledge of verification methodologies and tools such as simulators, waveform viewers, build and run automation, coverage collection.
  • Basic knowledge of formal verification methodology is a plus.
  • Excellent knowledge of one of the scripting languages such as Python, TCL is a plus.
  • Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated.
  • Ability to work well in a team and be productive under aggressive schedules.


Education and Experience:

  • PhD, Master’s Degree or Bachelor’s Degree in technical subject area.


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Comments

  1. Anonymous21 November 2022 at 03:22

    Thanks for posting fresher opportunity

    ReplyDelete
  2. Anonymous21 November 2022 at 04:39

    Amazing opportunity and it's product based right?

    ReplyDelete

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