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VLSI Packaging Evolution and Innovations

Hello Dear Readers,   Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
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Engineer I-Silicon Validation at Seagate

 Hello Dear Readers, 

Currently at Seagate Pune vacancy for Engineer I-Silicon Validation role.

About our group:

The group is part of Seagate's VLSI Organization spread globally across multiple sites. Seagate designs world-class controller SoCs for their HDDs. The group in Pune participates in the design, verification, physical design, and post-silicon validation activities of these complex SoCs. This group has some of the best talents from the industry and has taped out many controller chips.  

About the role - you will:

  • Participate in SoC post-silicon validation activities on HDD controllers such as Firmware development/enhancements for silicon validation
  • Participate in Validation test plan development for specific IP Codes
  • Work in Board/SoC to bring up participation, test plan execution and result logging
  • Collect debugging data using standard tools like protocol analyzers, logic analyzers, oscilloscopes 
About you:
  • Good  knowledge of Electronics
  • Ability to work under pressure and maintain positive attitude
  • Fluent in English communication and written communication
  • Good presentation skills

 

Your experience includes:

  • Good understanding of C programming
  • Good in problem-solving and decision making
  • Relevant Bachelor’s degree

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