Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Currently, at Bellatrix Aerospace vacancy for an FPGA Engineer role. Bellatrix Aerospace is an In-Space Mobility company developing new-age technologies that shape the future of our industry. We specialize in the development and production of propulsion systems and in-orbit transportation solutions. Our work has won two National Awards and backing of the government and many marque investors. At Bellatrix, we strive to create an environment that rewards creativity, performance and perseverance. At the same time, we also understand that failures are steppingstones to success on a journey to create something that never existing. In other words, our culture is fueled by intellectual curiosity, and our team takes pride in creating technologies that impact India and the world, growing together and achieving their goals each day. Job Description: End-to-end realization of spacecraft embedded systems based on FPGAs including following activities: 1. Design...