Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers,
Currently at Global Foundries, vacancy for Senior Eng CAD Engineering role.
About GlobalFoundries:
GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.
Introduction:
Technology Computer Aided Design tools are critical to accelerate the technology development and deployment in our Fabs. We are seeking to strengthen our TCAD team with highly motivated Individuals who are at the early phase of their career. The candidate brings passion for semiconductor technologies and devices, strives for high-quality work, cares about details, and is willing to learn and cooperate in a dynamic and rewarding environment.
Your Job:
- Provide TCAD Support to the Power Product Line. Apply commercial simulation software to mimic semiconductor process flows and device performance and highlight the opportunities for device optimization.
- Timely communication and delivery of appropriate understanding of the link between Process Flow and Device performance in terms of IV, CV, BV, Self-Heating, ESD, thermal and mechanical stress, etc. Perform model calibration work when necessary, based on measurements.
- Deep interaction with integration, device, and design engineers to assure development of a working technology. Anticipate integration/process issues, based on inputs from integration, process or design enablement and reliability teams.
- Work autonomously to drive optimal technology decisions by evaluating multiple optimization paths.
Required Skills:
- Good knowledge of VLSI Fabrication processes.
- Good knowledge of Semiconductor Device Physics.
- Good knowledge of commercially available TCAD tools.
- Ability to work in a team to solve complex problems.
- Ability to understand the time-value of the work and meet timelines.
Other Responsibilities:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Required Qualifications:
- Education master's in electrical engineering
- Years of Experience Preferred at least 1-2 year of working experience
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