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VLSI Packaging Evolution and Innovations

Hello Dear Readers,   Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
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Field Application Engineer at Prodigy Technovations

 Hello Dear Readers, 

Currently at Prodigy Technovations Pvt Ltd vacancy for Field Application Engineer role.


Job Description:

Responsible for pre and post sales activities such as understanding FPGA/ASIC flow based on customer requirements, recommending technical solution and arranging demonstration of the technical solution.


Education Qualification:

You should possess a B.E/B.Tech or Master's degree in Engineering in Electronics field with a major in relevant discipline

Experience/Skills:

  • Should have experience in developing C, VHDL+ Verilog +SV +UVM methodologies
  • Understanding of ASIC/FPGA/SOC is must
  • Hands- on experience with any simulator is a must.
  • Hands-on experience with any of FPGA Implementation phases and programming is a must.
  • Design testing and Verification/Methodology is plus
  • Designing, coding and debugging applications in various software languages is a plus.
  • Trouble shooting skills
  • Organizational skills
  • Object-oriented programming (OOP)/C++ is a plus
  • Generation of Code coverage from testbench is a plus
  • Experience/Understanding with ASIC /FPGA Design Rule Checking and Verification methodologies is a plus.











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