Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers,
Currently, at Wafer Space Bangalore vacancy for an RTL Front End Design Engineers role.
Job Responsibilities:
- Chip integration of high complexity SOCs.
- Coordinating with various IP owners on receivables and DV, synthesis and Emulation for deliverables
- Spyglass/CDC for the full chip and will evaluate the incoming bugs and take appropriate action
- Formal Verification between RTL to Netlist and Netlist to Netlist
- Manual and Conformal ECO
- Running Lint (Spyglass) at SoC level.
- Chip-level integration and connectivity.
- Debugging FV failures
- ECO implementation.
Desired Skills and Experience:
- 2 - 10 years of experience
- Sound knowledge in Micro Architecture design and RTL implementation
- Understanding of ARM SoCs with AXI/AHB buses, peripherals, CPUs, and mobile SOCs is desirable
- Experience in Synthesis and pre-layout timing analysis
- Understanding of DFT flow is desirable
- Experiencing using clear case a must
- Experienced with VHDL/Verilog/coding and tools like VCS/Verdi/Spyglass/Mentor Zero-in
- Proficiency in LEC and formal flows.
- Experience in Perl, TCL, and shell scripting
- Excellent interpersonal & analytical skills with the ability to work independently
Is it for freshers?
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