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VLSI Packaging Evolution and Innovations

Hello Dear Readers,   Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
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Physical Design Engineer at IBM Bangalore

 Hello Dear Readers, 

Currently, at IBM Bangalore vacancy for a Physical Design Engineer role.

Introduction:

As a Hardware Developer at IBM, you’ll get to work on the systems that are driving the quantum revolution and the AI era. Join an elite team of engineering professionals who enable IBM customers to make better decisions quicker on the most trusted hardware platform in today’s market.

Your Role and Responsibilities:

  • Responsible for high-performance microprocessor blocks RTL to GDSII implementation
  • Perform block level synthesis, floor planning, placement, and routing.
  • Close the design to meet timing, power budget, and area.
  • Implement ECOs to address functional bugs and timing violations.
  • Team player with good problem-solving and communication skills.

Required Technical and Professional Expertise:

  • 1-3 years of industry experience in physical design methodology.
  • Good knowledge and hands on experience in physical design methodology which include logic synthesis, placement, clock tree synthesis, routing .
  • Should be knowledgeable in physical verification ( LVS,DRC.. etc) ,Noise analysis, Power analysis and electro migration

Preferred Technical And Professional Expertise:

  • Automation skills in PERL,SKILL and/or TCL
About Business Unit:
India Systems Development Lab (ISDL) is part of IBM Systems world-wide technology development lab. Established in 1996, the Lab is headquartered in India's Silicon Valley and startup hub - Bengaluru, with a strong presence in Pune and Hyderabad. Developers at ISDL deliver technology innovations across the entire Systems portfolio - z Systems, Power / OpenPOWER Systems and Storage. The team here works across the entire stack from processor design, firmware, operating system to software defined storage. The lab also focuses on innovations, thanks to the creative energies of the teams. The lab has contributed over 400+ patents in cutting-edge technologies and inventions.


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