Hello Dear Readers, Today in this post, I will provide some deep insight into the VLSI packaging evolution and innovations. Semiconductor packaging has evolved from a simple protective housing into a critical performance enabler. In the modern VLSI landscape, packaging is no longer an afterthought; it is a fundamental determinant of PPA (Power, Performance, and Area) metrics, often dictating the thermal limits and signal integrity of the final SoC. 1. Traditional Packaging Technologies: These methods are the workhorses of the industry, widely used for low-to-medium complexity devices where cost-efficiency is paramount. Wire Bonding (QFN, QFP, DIP): Wire bonding is the most mature interconnection technology. It uses thin gold, copper, or aluminum wires to connect the die's bond pads to the package's internal leadframe. Implementation: The die is attached face-up to a leadframe or substrate. A wire bonder uses thermocompression or ultrasonic energy to attach wires betwee...
Hello Dear Readers, Today, I will explain how one can modeling an Internally and Gated clock using Verilog HDL. 1). Internally Generated Clocks: Internally generated clock signals use a system or master clock and generate output as an internally generated clock signal. But, internally generated clock signals need to be avoided as it causes the functional and timing issues in the design. The functional and timing problems are due to the combinational logic propagation delays. The internally generated clock signals can generate a glitch or spike in the output. This can trigger the sequential logic multiple times or can generate undesired output. Even due to violation of setup or hold time these types of designs have timing violations. It is always recommended to generate the internal clocks by using register output logic. But still due to the propagation delay of the flip-flop, the overall cumulative delay or skew can generate glitches or spikes in the design. As shown b...