Hello Dear Readers, Qualcomm Bangalore currently has a vacancy for an SRAM/Memory CAD Engineer. As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronic...
Hello Dear Readers, Today in this post, learn about PowerVia Test which is Intel's first to implement backside power in a product like chip, resulting in over 90% cell utilization and other gains. Intel is the first in the industry to implement backside power delivery on a product-like test chip, achieving the performance needed to propel the world into the next era of computing. PowerVia, which will be introduced on the Intel 20A process node in the first half of 2024, is Intel’s industry-leading backside power delivery solution. It solves the growing issue of interconnect bottlenecks in area scaling by moving power routing to the backside of a wafer. PowerVia is a major milestone in our aggressive ‘five nodes in four years’ strategy and on our path to achieving a trillion transistors in a package in 2030. Using a trial process node and subsequent test chip-enabled us to de-risk backside power for our leading process nodes, placing Intel a node ahead of competi...